Our X-Ray Imaging in Real Time utilizes the latest in X-ray Imaging Technology built by Glenbrook Technologies for Non-Destructive inspection of electronic components.

Our vast and ever growing library of component images enables us to quickly and accurately perform internal comparative analysis against verified component images. The high resolution provided allows for continuity inspection of all wire bond interconnects and BGA ball placements.

This system also allows for single layer inspection of electronic components without removing them from tubes, trays or tape. This enables us to do an inspection without breaking the original seals.

All relevant digital images are captured and supplied to our customers via email, hardcopy or CD as part of our service. When necessary, component images can be supplied via email on the same day the material arrives at our facility.

• Real Time X-Ray Imagaing  
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•   Die Verification  
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•   Microscopy Inspection  
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•   XRF RoHS Testing  
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•   3D Coplanarity Testing  
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•   Tape & Reel  
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•   Baking & Dry Packing